Page 39 - Univac Catalog_E_Book

DBR SYSTEM

<Ion Assist 無> <Ion Assist 有> Description Speci cation

- Vertical type
- Material : STS304
Process Chamber Process chamber - Size : Ø2050mm(D) × 1650mm(H)
Ø1350mm(D) × 1400mm(H)
- Heating : Micro sheathe heater
Substrate rotation Rotation - Rotational type : Revolution and
& carrier rotation
HV Pump - Oil diffusion or Cryo Pump
Exhausting system
- Rotary vane pump
LV Pump
- Booster pump
E/B Gun #1 - SiO2 only
Evaporation source - No. of crucible : 20
E/B Gun #2
• Dual E-Beam source - Quantity of crucible : 25cc
• RF Ion source Ion beam - Size : 170mm, 230mm
• Thickness monitor
RF Ion beam source - RF2002, 1200Watt
Power supply
Optical Process Monitoring - 50 ~ 1200V, 1200mA
QCM (Quartz Crystal Microbalance) QCM
Thickness monitor
OMS - Wavelength 350 ~ 1100nm
- Glass changer 80 point
Processing gas supply M.F.C - 100sccm~500sccm
Vacuum gauge - Cold cathode gauge & Pirani gauge
Gas flow 5 × E-6 mbar l/s, (Max.),
Auto pressure control -
1,250mbar l/s(Min.)
System controller - PC(HMI) + PLC(I/O)+Thickness monitor
■ 230mm RFsource

Item spec
Ultimate Pressure ≤ 5.0×10 -5 Pa
Leak Rate ≤ 2.0×10 -3 Pa D
F
Build up ≤ 7.0×10-6 Pa・m3/s
A Processing Chamber
Pumping speed 27,000L/sec G
Uniformity 250±10℃ B System Controller C
Heat Heating Temp. Range
performance 25~350℃ E
Temp. Rising Time ≤ 30min (250±10℃) C Electron beam power supply
■ 170mm RFsource
Single layer
film Tickness Within ±1.0% at optical film D Ion beam power supply
thickness 3/4λ（λ=650nm）
Uniformity B
E High vacuum pump
Deposition General ＊# of layers：40 Layers (Oil diffusion / Cryo/ Turbo pump) A
Performance. Deposition ＊Characteristic：IA＝5° Rave>98% ＠
performance 420nm~700nm F Low vacuum pump
IA＝5° R<10% ＠1064nm
(Rotary pump+Booster)
Reflectance 420~700nm : >98%
G Water vapor cryocooler

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