Page 36 - Univac Catalog_E_Book

MAGNETRON SPUTTERING SYSTEM ARC SPUTTERING SYSTEM

USP The Univac sputtering deposition system, USP 450
incorporates 6 cylindrical targets in side wall for
increasing deposition rate and multi-layer coating.
450 This system is provided with DC pulse or RF power

round cylindrical cathodes. Vertically mounted
substrates and cylindrical cathodes minimize
particulate contamination during coating process.

Inside view of UPS 450 Cylindrical target

Arc Sputter system is a combination of arc deposition and sputtering deposition within the same vacuum
chamber, these deposition can be used independently or consecutively. Our systems are capable of precision
coating a wide range of substrates with a metallic colors on surfaces. According to customers’ needs, the
HORIZONTAL TYPE structure of vacuum equipment systems can be designed in One door type or Two door type.
SPUTTERING SYSYTEM SPECIFICATIONS

Ceramics Heating system by micro heater Cylinder arc targer
System Model UPS 450

Chamber 516 x 628 x 914 H Linear type ion source
Chamber Target room 370 x 170 x 914 H System rack
Outlet room 516 x 526 x 360 H
Oil Diffusion Pump 22" 1 set or TMP
Pumping Mechanical Booster 1,200 m³/h Plastics
System Pump
Oil Rotary Pump 3,000 l/min
Substrate Heater Max. 250 ℃ (substrate)
Power DC+RF, 10kW, 2set

Vacuum gauge High Vacuum Ion Gauge or Active Metals
controller Low Vacuum Convection or Pirani

Deposition Crystal Monitoring System Substrate connected
Controller Optical Monitoring System BIAS power supply DC ARC power supply for arc deposition(300A)
Magnetron sputtering target DC Puls power supply for sputtering(20kW, 30Hz)
Target Cylindrical type 1 part 2ea, total 6ea
Image of plasma DC power supply for ion source(5kW, normal)
generation Cylindrical target Cooling System 20RT DC power supply for BIAS(10kW)

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