Page 33 - Univac Catalog_E_Book
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AR/AF SPUTTERING SYSTEM                                          Description                  Speci cation



                                                                                      -  Vertical type
                                                         Process Chamber  Process chamber  -  Material : STS304
                                                                                      -  Size : Ø1650mm x 1840mm
                                                         Substrate rotation   Rotation  -  Rotational type : Revolution and
                                                         & carrier                     rotation
                                                                          HV Pump     -  Turbo pump
                                                         Exhausting system
                                                                          LV Pump     -  Dry pump
                                                                         Pirani gauge  - Low Vac Range :760torr ~ 3×E-4torr
                                                          Vacuum gauge
                                                                          Ion gauge   - High Vac Range :8×E-3 ~ 3×E-9torr
                                                          Cooling system  Polycold    -  Cold chiller
                                                          Heating system              -  Outgasing purpose
                                                          Processing gas   M.F.C      -  MFC(N2,O2 100sccm)
                                                            Control                   -  APC : needle valve
                                                                                      -  Dual cylindrical target
                                                            Source     Cylinderical Target
                                                                                      -  Thickness: 10mmT
                                                                                      -  Power : up to 100kw DC or 80kw MF/AC
                                                                          End Block
                                                                                       V/A : 1000V/225A
                                                          Sputter source
                                                                          Magnet      -  70%↑ target Utilization, ±5% Uniformity
                                                EnerPulse 10
                                                                                      -  100mm(W) × 1,400mm(H)
                                                           Ion Source     Linear type
                                                                                      -  10kw, Ar,O2 /500sccm
 BENEFITS                                                 Thermal source  Center pole  -  30kw
                                                                         Electric power  - 3ph 220V/440V 60Hz
                                                         Electric /Control
 - AR/AF coating by sputtering  Description  Speci cation                 Control     - PC(HMI)+PLC(I/O) Programming
   Substrate cleaning by LIS  -  Vertical type
 - High density / Uniformity  Process Chamber  Process chamber  -  Material : STS304
   High deposition rate  -  Size : Ø1650mm x 1840mm
   Process stability  Substrate rotation   Rotation  -  Rotational type : Revolution and
   Easy replacement target  & carrier  rotation
 HV Pump  -  Turbo pump
 Exhausting system
 LV Pump  -  Dry pump
 Pirani gauge  - Low Vac Range :760torr ~ 3×E-4torr
 Vacuum gauge                                              E             D
 Ion gauge  - High Vac Range :8×E-3 ~ 3×E-9torr  A  Processing Chamber
 Cooling system  Polycold  -  Cold chiller
           B  System Controller
 Heating system  -  Outgasing purpose
 Processing gas   M.F.C  -  MFC(N2,O2 100sccm)  C  High vacuum pump
 Control  -  APC : needle valve
              (Oil diffusion / Cryo/ Turbo pump)                                                     B
 -  Dual cylindrical target                                                  C
 Source  Cylinderical Target  D  Low vacuum pump
 -  Thickness: 10mmT
              (Rotary pump+Booster)
 -  Power : up to 100kw DC or 80kw MF/AC
 End Block
 V/A : 1000V/225A  E  Water vapor cryocooler                                 A
 Sputter source
 Plasma  Magnet  -  70%↑ target Utilization, ±5% Uniformity
 Ti
 Ion Source  Linear type  -  100mm(W) × 1,400mm(H)
 Ti  -  10kw, Ar,O2 /500sccm
 Thermal source  Center pole  -  30kw
 Electric power  - 3ph 220V/440V 60Hz
 Electric /Control
 Control  - PC(HMI)+PLC(I/O) Programming


 Chamber wall
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