Page 29 - Univac Catalog_E_Book
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SPUTTERING SYSTEM 溅射镀膜机
[SPUTTERING]
Sputtering is vacuum process used to deposit very thin films on the substrates for a wide variety of
commercial and scientific purposes.
It is performed by applying a high voltage across a low pressure gas (usually argon gas at about 5 millitorr)
to create a "plasma," which consists of electrons and gas ions in a high energy state. This is sometimes
called a glow discharge process because the plasma emits a colorful halo of light.
During sputtering, energized plasma ions strike a "target", composed of the desired coating
material, and cause atoms from that target to be ejected with enough energy to travel to,
and bond with substrate.
RADICAL SPUTTERING SYSTEM
SPUTTERING
SYSTEM SERIES 溅射镀膜机
AF / THERMAL
AR/AF SPUTTERING SYSTEM
SPUTTERING SYSTEM
MAGNETRON SPUTTERING SYSTEM ARC SPUTTERING SYSTEM
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