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Sputtering System

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“SPUTTERING” is a vacuum process used to deposit very thin films on substrates.
We provide Sputtering Coating Systems.
The models are classified according to the functions and specifications of the product.

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AR/AF Sputtering System

AR/AF Sputtering System image

AR/AF coating by sputtering
Substrate cleaning by LIS
High density / Uniformity
High deposition rate
Process stability
Easy replacement target

image 01 Plasma Chamber wall
image 02
Front view drawing image
AR/AF Sputtering System information
Description Specification
Process Chamber Process chamber Vertical type
Material : STS304
Size : Ø1650mm x 1840mm
Substrate rotation & carrier Rotation Rotational type : Revolution and rotation
Exhausting system HV Pump Turbo pump
LV Pump Dry pump
Vacuum gauge Pirani gauge Low Vac Range :760torr ~ 3×E-4torr
Ion gauge High Vac Range :8×E-3 ~ 3×E-9torr
Cooling system Polycold Cold chiller
Heating system Outgasing purpose
Processing gas Control M.F.C MFC(N2,O2 100sccm)
APC : needle valve
Source Cylinderical Target Dual cylindrical target
Thickness: 10mmT
Sputter source End Block Power : up to 100kw DC or 80kw MF/AC
V/A : 1000V/225A
Magnet 70%↑ target Utilization, ±5% Uniformity
Ion Source Linear type 100mm(W) × 1,400mm(H)
10kw, Ar,O2 /500sccm
Thermal source Center pole 30kw
Electric /Control Electric power 3ph 220V/440V 60Hz
Control PC(HMI)+PLC(I/O) Programming
  1. AProcessing Chamber
  2. BSystem Controller
  3. CHigh vacuum pump
  4. DLow vacuum pump
  5. EWater vapor cryocooler
Plane drawing image

As Korea vacuum coating system offers, UNIVAC is optical coating technology LTD

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